Showing 1 - 10 of 12, total 2 pages [First] [Previous] [ Next] [ Last] |
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1 | | | centerless grinding wheels Specification: 200¡Á5¡Á50¡Á75mm Detail: used for grinding round sticks of carbide and Al2O3¡¢ZrO2¡¢SiC ceramics. Different sizes are available on inquiry. |
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2 | | | resin-bonded cbn straight grinding wheels Specification: 30/500mm Detail: mainly used in the thin hardware sheet, the air compressor, and so on. Different sizes are variable on inquiry. |
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3 | | | resin-bonded cbn grinding disc series Specification: 305/710mm Detail: mainly used for the thin hardware sheet, the air compressor, and so on. Different sizes are variable on inquiry. |
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4 | | | resin-bonded diamond grinding wheels Specification: 75/450mm Detail: For cutting Carbide, magnetic material, glass, ceramic. &©|8226;good self-sharpening&©|8226;high grinding efficiency, low grinding heat and no loading&©|8226;the processed workpiece has good surface roughness. |
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5 | | | cbn straight grinding wheels Specification: 30-600mm Detail: Diamond wheels£ºCompound piece (PCD, PCBN), carbide, eramic, diamond processing. CBN wheels£ºAutomobile, crank, cam shaft, machine, hydraulic pressure works. |
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6 | | | cbn grinding discs Specification: 305¡Á45mm Detail: mainly used in the thin hardware sheet, the air compressing accessories, and so on. Different sizes are variable on inquiry. |
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7 | | | for precision industry Specification: 5/34mm Detail: Mainly used for honing holes, the air compressor, hydraulic pressure works, mold |
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8 | | | vacuum brazed saw blade Specification: 105¡Á4¡Á2.0¡Á5.0mm Detail: Mainly used for rescue operations with high cutting efficiency |
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9 | | | laser welding cement saw blade Specification: 105¡Á2.0¡Á7.0mm Detail: used for cutting concrete, such as reinforced concrete, green concrete, old concrete, asphalt.&©|8226;dry cut and wet cut with low power &©|8226;high cutting efficiency. Different sizes are variable on inquiry. |
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10 | | | continous rim saw blade for monocrystalline and polysilicon Specification: 102/450mm Detail: used for cutting and grooving of monocrystalline and polysilicon,such as chips and solar cells. |
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